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Showing results 1 to 2 of 2

Issue DateTitleAuthor(s)
2018-02-222D Single-Crystalline Copper Nanoplates as a Conductive Filler for Electronic Ink ApplicationsLee, Jin-Won; Han, Jiyoon; Lee, Dong Su; Bae, Sukang; Lee, Sang Hyun; Lee, Seoung-Ki; Moon, Byung Joon; Choi, Chel-Jong; Wang, Gunuk; Kim, Tae-Wook
2020-10Effect of aspect ratio of vertically aligned copper nanowires in the presence of cellulose nanofibers on the thermal conductivity of epoxy compositesThieu, Nhat Anh Thi; Vu, Minh Canh; Kim, Dae Hoon; Choi, Won Kook; Kim, Sung-Ryong
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