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Showing results 1 to 2 of 2

Issue DateTitleAuthor(s)
2019-113D Printer-Based Encapsulated Origami Electronics for Extreme System Stretchability and High Areal CoverageJo, Mansik; Bae, Seunghwan; Oh, Injong; Jeong, Ji-hun; Kang, Byungsoo; Hwang, Seok Joon; Lee, Seung S.; Son, Hae Jung; Moon, Byung-Moo; Ko, Min Jae; Lee, Phillip
2021-12A 4D Printable Shape Memory Vitrimer with Repairability and Recyclability through Network Architecture Tailoring from Commercial Poly(epsilon-caprolactone)Joe, Jungho; Shin, Jeehae; Choi, Yong-Seok; Hwang, Jae Hyuk; Kim, Sang Hwa; Han, Jiseok; Park, Bumsoo; Lee, Woohwa; Park, Sungmin; Kim, Yong Seok; Kim, Dong-Gyun
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