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Showing results 1 to 5 of 5

Issue DateTitleAuthor(s)
2003-10A new pulse plasma enhanced atomic layer deposition of tungsten nitride diffusion barrier for copper interconnectSim, HS; Kim, SI; Jeon, H; Kim, YT
-DI-WeM8 characteristics of tungsten nitride atomic layer deposition심현상; Kim Yong Tae; H. Jeon
-Digital deposition of tungsten nitride thin layer by sequential exposure of tung sten hexafluoride and ammonia심현상; 김동준; Kim Yong Tae; 전형탁
-Effects of NH3 pulse plasma on atomic layer deposition of tungsten nitride diffusion barrierKim, Yong Tae; Chang Woo Lee
2013-10Investigation of Tungsten Nitride Deposition Using Tungsten Hexafluoride Precursor for Via and Plug MetallizationHwang, Yeong-Hyeon; Cho, Won-Ju; Kim, Yongtae
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