2008 | Preparation of Pt-Ru-Co ternary catalyst on carbon paper for PEMFC with electrodeposition and galvanic displacement | Ahn, Sang Hyun; Kim, Soo-Kil; Kwon, Oh Joong; Hwang, Sun-Mi; Kim, Jae Jeong |
2019-10-15 | Proton-exchange membrane CO2 electrolyzer for CO production using Ag catalyst directly electrodeposited onto gas diffusion layer | Ham, Yu Seok; Park, Young Sang; Jo, Ara; Jang, Jong Hyun; Kim, Soo-Kil; Kim, Jae Jeong |
2025-01 | Revealing the complexation of 3-N,N-dimethylaminodithiocarbamoyl-1-propanesulfonic acid (DPS) with cuprous ion and its contribution to Cu electrodeposition | Lee, Jiseok; Kim, Jihyun; Cho, Sung Ki; Kim, Jae Jeong |
2024-12 | Self-assembly of surfactant mixtures for a versatile control of the rate of the heterogeneous reaction: Case study in Cu electrodeposition | Shin, Yeong Min; Lee, Jiseok; Lim, Yeon-Su; Kim, Jae Jeong; Jin, Kyeong Sik; Lee, Hee-Young; Cho, Sung Ki |
2008-05 | Silver direct electrodeposition on Ru thin films | Koo, Hyo-Chol; Cho, Sung Ki; Lee, Chang Hwa; Kim, Soo-Kil; Kwon, Oh Joong; Kim, Jae Jeong |
2014-03-06 | Synthesis of an active and stable Pt-shell-Pd-core/C catalyst for the electro-oxidation of methanol | Choi, Insoo; Ahn, Sang Hyun; Kim, Myeong Ho; Kwon, Oh Joong; Kim, Jae Jeong |
2008-04-30 | The influence of thiourea on copper electrodeposition: Adsorbate identification and effect on electrochemical nucleation | Kang, Moo Seong; Kim, Soo-Kil; Kim, Keeho; Kim, Jae Jeong |
2009-01 | Thin film silver deposition by electroplating for ULSI interconnect applications | Seo, Joon-Mo; Cho, Sung Ki; Koo, Hyo-Chol; Kim, Soo-Kil; Kwon, Oh Joong; Kim, Jae Jeong |
2008-01 | Two-step filling in Cu electroless deposition using a concentration-dependent effect of 3-N,N-dimethylaminodithiocarbamoyl-1-propanesulfonic acid | Lee, Chang Hwa; Kim, Ae Rim; Kim, Soo-Kil; Koo, Hyo-Chol; Cho, Sung Ki; Kim, Jae Jeong |