Showing results 11 to 13 of 13
Issue Date | Title | Author(s) |
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2008-04-30 | The influence of thiourea on copper electrodeposition: Adsorbate identification and effect on electrochemical nucleation | Kang, Moo Seong; Kim, Soo-Kil; Kim, Keeho; Kim, Jae Jeong |
2009-01 | Thin film silver deposition by electroplating for ULSI interconnect applications | Seo, Joon-Mo; Cho, Sung Ki; Koo, Hyo-Chol; Kim, Soo-Kil; Kwon, Oh Joong; Kim, Jae Jeong |
2008-01 | Two-step filling in Cu electroless deposition using a concentration-dependent effect of 3-N,N-dimethylaminodithiocarbamoyl-1-propanesulfonic acid | Lee, Chang Hwa; Kim, Ae Rim; Kim, Soo-Kil; Koo, Hyo-Chol; Cho, Sung Ki; Kim, Jae Jeong |