Showing results 3 to 3 of 3
Issue Date | Title | Author(s) |
---|---|---|
2018-05 | Micro-architecture embedding ultra-thin interlayer to bond diamond and silicon via direct fusion | 김종식; Jong Cheol Kim; Yan Xin; Jinhyung Lee; Young-Gyun Kim; Ghatu Subhash; Rajiv K. Singh; Arul C. Arjunan; Haigun Lee |