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Showing results 1 to 3 of 3

Issue DateTitleAuthor(s)
-Effects of current wave forms and current densities on the electroplated Cu interconnection in damascene plating이유용; PARK YOUNG JOON; Cho Byung Won; 이재봉
2002-08Effects of leveler on the trench filling during damascene copper plating이유용; 박영준; 이재봉; 조병원
2001-12The electrochemical characteristics of mercapto compounds on the copper electroplating손상기; 이유용; 조병원; 이재봉; 이태희
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