| 1997-03 | Anodic bonding technique under low temperature and low voltage using evaporated glass | Choi, WB; Ju, BK; Lee, YH; Haskard, MR; Sung, MY; Oh, MH |
| 2001-03 | Effect of oxygen plasma treatment on anodic bonding | Choi, SW; Choi, WB; Lee, YH; Ju, BK; Kim, BH |
| 1997-12 | Experimental analysis on the anodic bonding with an evaporated glass layer | Choi, WB; Ju, BK; Lee, YH; Jeong, JW; Haskard, MR; Lee, NY; Sung, MY; Oh, MH |
| 1999-01 | Glass-to-glass bonding for vacuum packaging of field emission display in an ultra-high-vacuum chamber using silicon thin film | Choi, WB; Ju, BK; Lee, YH; Jeong, SJ; Lee, NY; Sung, MY; Oh, MH |
| 1998-11 | Glass-to-glass electrostatic bonding for FED tubeless packaging application | Ju, BK; Choi, WB; Lee, YH; Jung, SJ; Lee, NY; Han, JI; Cho, KI; Oh, MH |
| 1999-01 | Novel bonding technology for hermetically sealed silicon micropackage | Lee, DJ; Ju, BK; Choi, WB; Jeong, JW; Lee, YH; Jang, J; Lee, KB; Oh, MH |
| 1999-01 | Silicon-to-indium tin oxide coated glass bonding for packaging of field emission arrays fabricated on silicon wafer | Choi, WB; Ju, BK; Lee, YH; Oh, MH; Lee, NY; Sung, MY |
| 2002-01 | The analysis of oxygen plasma pretreatment for improving anodic bonding | Choi, SW; Choi, WB; Lee, YH; Ju, BK; Sung, MY; Kim, BH |
