Showing results 1 to 2 of 2
| Issue Date | Title | Author(s) |
|---|---|---|
| - | RF-MEMS package with vertical via hole for low loss characteristic | Yun-Kwon Park; Heung-Woo Park; Duck-Jung Lee; Jung-Ho Park; Chung-Woo Kim; Ci-Moo Song; Chul-Ju Kim; Ju Byeong Kwon |
| - | Vacuum in-line packaging and characterization of the surface-micromachined vacuum magnetic field sensors | Heung-Woo Park; Yun-Kwon Park; Duck-Jung Lee; Chul-Ju Kim; Jung-Ho Park; OH MYUNG HWAN; Ju Byeong Kwon |