Browsing byAuthorDuck-Jung Lee
Showing results 1 to 10 of 10
| Issue Date | Title | Author(s) |
|---|---|---|
| - | Application of electrostatic bonding to FED packaging | Duck-Jung Lee; Ju Byeong Kwon; Nam-Yang Lee; Seong-Jae Jeong; Jin-Jang; OH MYUNG HWAN |
| - | Development of AC-PDP tubeless packaging method and their operating characteristics | Seung-Woo Choi; Ju Byeong Kwon; Duck-Jung Lee; LEE YUN HI; OH MYUNG HWAN; Gwon-Jin Moon; Jun-Dong Kim; Jin-Wook Jeoung; Young-Cho Kim |
| - | Development of flat type back-lamp using carbon nano tubes grown on glass substrate | LEE YANG DOO; Duck-Jung Lee; Jeung Hoon Park; Jae-eun Yoo; Yun-Hi Lee; Jin Jang; Ju, Byeong Kwon |
| - | Flat lamp packaging technology using carbon nano tubes | Duck-Jung Lee; LEE YUN HI; Ju Byeong Kwon; Jae-Eun Yoo; Byung-Don Min; Jeung-Hoon Park; Bong-Chul Kim; Byung-Kyo Lee; Jin Jang |
| - | PDP tubeless packaging by using epoxy gluing process at room temperature | Seung-Il Moon; Duck-Jung Lee; OH MYUNG HWAN; LEE YUN HI; Ju Byeong Kwon; Young-Cho Kim; Gwon-Jin Moon; Jun-Dong Kim |
| - | PDP tubeless packaging using B-stage epoxy | Seung-Il Moon; Duck-Jung Lee; OH MYUNG HWAN; LEE YUN HI; Ju Byeong Kwon; Young-Cho Kim; Gwon-Jin Moon; Jun-Dong Kim |
| - | RF-MEMS package with vertical via hole for low loss characteristic | Yun-Kwon Park; Heung-Woo Park; Duck-Jung Lee; Jung-Ho Park; Chung-Woo Kim; Ci-Moo Song; Chul-Ju Kim; Ju Byeong Kwon |
| - | Thin PDP packaging technology by direct-joint method | Duck-Jung Lee; Ju Byeong Kwon; LEE YUN HI; Yun-Kwon Park; Jun-Dong Kim; Gwon-Jin Moon; Jin Jang; OH MYUNG HWAN |
| - | Vacuum in-line packaging and characterization of the surface-micromachined vacuum magnetic field sensors | Heung-Woo Park; Yun-Kwon Park; Duck-Jung Lee; Chul-Ju Kim; Jung-Ho Park; OH MYUNG HWAN; Ju Byeong Kwon |
| - | Vacuum in-line packaging technology of AC-PDP using direct-joint method | Duck-Jung Lee; Seung-Il Moon; LEE YUN HI; Ju Byeong Kwon; Jun-Dong Kim; Gwon-Jin Moon; Jin Jang |
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