Showing results 1 to 1 of 1
Issue Date | Title | Author(s) |
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- | A low temperature direct bonding method using an electron-beam evaporated silicon-oxide interlayer | Ju Byeong Kwon; LEE YUN HI; OH MYUNG HWAN; H. W. Park; J. H. Park; N. Y. Lee; K. H. Koh; D. K. Shin; I. B. Kang; N. Samaan; M. R. Haskard |