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Issue DateTitleAuthor(s)
2022-08Thermally Responsive Imidazole-Based Diels-Alder Microbeads as a Latent Curing Agent for Epoxy ResinsSungmin Jung; KIM, YOON SANG; Jang, Han Gyeol; Park, Jong Hyuk; Park, Min; Choi, Yong Seok; Kim, Jae woo
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