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Showing results 1 to 3 of 3

Issue DateTitleAuthor(s)
2021-023Dprinting of copper particles and poly(methyl methacrylate) beads containing poly(lactic acid) composites for enhancing thermomechanical propertiesMinh Canh Vu; Jeong, Tae-Hyeong; Kim, Jun-Beom; Choi, Won Kook; Kim, Dae Hoon; Kim, Sung-Ryong
2020-10Effect of aspect ratio of vertically aligned copper nanowires in the presence of cellulose nanofibers on the thermal conductivity of epoxy compositesThieu, Nhat Anh Thi; Vu, Minh Canh; Kim, Dae Hoon; Choi, Won Kook; Kim, Sung-Ryong
2020-05High Thermal Conductivity Enhancement of Polymer Composites with Vertically Aligned Silicon Carbide Sheet ScaffoldsVu, Minh Canh; Choi, Won-Kook; Lee, Sung Goo; Park, Pyeong Jun; Kim, Dae Hoon; Islam, Md Akhtarul; Kim, Sung-Ryong
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