Showing results 1 to 2 of 2
Issue Date | Title | Author(s) |
---|---|---|
2021-04 | Copper-graphene heterostructure for back-end-of-line compatible high-performance interconnects | Son, Myungwoo; Jang, Jaewon; Lee, Yongsu; Nam, Jungtae; Hwang, Jun Yeon; Kim, In S.; Lee, Byoung Hun; Ham, Moon-Ho; Chee, Sang-Soo |
2021-06 | Large-Area Bernal-Stacked Bilayer Graphene Film on a Uniformly Rough Cu Surface via Chemical Vapor Deposition | Son, Myungwoo; Jang, Jaewon; Kim, Gi-Hwan; Lee, Ji-Hwan; Chun, Dong Won; Bae, Jee Hwan; Kim, In S.; Ham, Moon-Ho; Chee, Sang-Soo |