Showing results 1 to 1 of 1
| Issue Date | Title | Author(s) |
|---|---|---|
| 2018-05-21 | Micro-architecture embedding ultra-thin interlayer to bond diamond and silicon via direct fusion | Kim, Jong Cheol; Kim, Jongsik; Xin, Yan; Lee, Jinhyung; Kim, Young-Gyun; Subhash, Ghatu; Singh, Rajiv K.; Arjunan, Arul C.; Lee, Haigun |