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Showing results 1 to 2 of 2

Issue DateTitleAuthor(s)
2022-12Bowing-alleviated continuous bandgap engineering of wafer-scale WS(2)(x)Se(2(1-x) )monolayer alloys and their assembly into hetero-multilayersKang, Hee Seong; Kang, Jung Hoon; Lee, Sol; Lee, Kihyun; Koo, Do Hyoung; Kim, Yong-Sung; Hong, Young Joon; Kim, Yong-Jin; Kim, Kwanpyo; Lee, Donghun; Lee, Chul-Ho
2025-02Conductive-bridge interlayer contacts for two-dimensional optoelectronic devicesJang, Jisu; Hong, Jung Pyo; Kim, Sang-Jun; Ahn, Jongtae; Yu, Byoung-Soo; Han, Jaewon; Lee, Kihyun; Ha, Aelim; Yoon, Eunki; Kim, Wonsik; Jo, Suyeon; Ko, Hyun Woo; Yoon, Seon Kyu; Taniguchi, Takashi; Watanabe, Kenji; Baek, Hogil; Kim, Dae-Yeon; Lee, Kimoon; Mun, Sungchul; Lee, Kyu Hyoung; Park, Soohyung; Kim, Kwanpyo; Song, Young Jae; Lee, Seung Ah; Kim, Hyunwoo J.; Shim, Jae Won; Wang, Gunuk; Kang, Ji-Hoon; Park, Min-Chul; Hwang, Do Kyung
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