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Issue DateTitleAuthor(s)
2022-12Bowing-alleviated continuous bandgap engineering of wafer-scale WS(2)(x)Se(2(1-x) )monolayer alloys and their assembly into hetero-multilayersKang, Hee Seong; Kang, Jung Hoon; Lee, Sol; Lee, Kihyun; Koo, Do Hyoung; Kim, Yong-Sung; Hong, Young Joon; Kim, Yong-Jin; Kim, Kwanpyo; Lee, Donghun; Lee, Chul-Ho
1

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