Showing results 1 to 1 of 1
Issue Date | Title | Author(s) |
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2019-11 | 3D Printer-Based Encapsulated Origami Electronics for Extreme System Stretchability and High Areal Coverage | Jo, Mansik; Bae, Seunghwan; Oh, Injong; Jeong, Ji-hun; Kang, Byungsoo; Hwang, Seok Joon; Lee, Seung S.; Son, Hae Jung; Moon, Byung-Moo; Ko, Min Jae; Lee, Phillip |