Browsing byAuthorLee, Seung-Gun

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Issue DateTitleAuthor(s)
2025-06Evaluating the Adhesive Properties of Electroless Cu on Glass-Reinforced Epoxy-Based Build-Up Dielectric Films via NanoindentationKang, Yeojin; Park, Wonjung; Yoo, Dayoung; Won, Kyung-Ah; Lee, Seung-Gun; Kim, Jong-Man; Kim, Yangdo; Lee, Dongyun

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