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Showing results 1 to 3 of 3

Issue DateTitleAuthor(s)
2001-04Au-Ni-Sn intermetallic phase relationships in eutectic Pb-Sn solder formed on Ni/Au metallizationSong, HG; Ahn, JP; Minor, AM; Morris, JW
1998-08-10Effects of precipitate distribution on electromigration in Al-Cu thin-film interconnectsHan, JH; Shin, MC; Kang, SH; Morris, JW
2001-09The microstructure of eutectic Au-Sn solder bumps on Cu/electroless Ni/AuSong, HG; Ahn, JP; Morris, JW
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