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Showing results 1 to 3 of 3

Issue DateTitleAuthor(s)
-A low temperature direct bonding method using an electron-beam evaporated silicon-oxide interlayerJu Byeong Kwon; LEE YUN HI; OH MYUNG HWAN; H. W. Park; J. H. Park; N. Y. Lee; K. H. Koh; D. K. Shin; I. B. Kang; N. Samaan; M. R. Haskard
-The influence of ambient gases on the emission characteristics of Mo-FEAs during the frit-sealing cycleN. Y. Lee; 김봉철; Jung Jae Hoon; 강문식; H. Kim; Ju Byeong Kwon; LEE YUN HI; OH MYUNG HWAN; J. Jang; AN SE YOUNG
-Tubeless packaging of field emission display using glass to glass electrostatic bonding technology정지원; Ju Byeong Kwon; 이덕중; LEE YUN HI; N. Y. Lee; Y. W. Ko; Y. G. Moon; CHOI DOO JIN; OH MYUNG HWAN
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