Showing results 1 to 5 of 5
Issue Date | Title | Author(s) |
---|---|---|
1997-03 | Anodic bonding technique for silicon-to-ITO coated glass bonding | CHOI, WOO BEOM; Ju, B.-K.; Lee, Y.-H.; Oh, M.-H.; Sung, M.-Y. |
1997-03 | Direct bonding between spacer and field emitter array using an electron-beam evaporated interlayer | Park, H.-W.; Ju, B.-K.; Lee, Y.-H.; Kang, I.-B.; Samaan, N.; Haskard, M.R.; Park, J.-H.; Oh, M.-H. |
2001-12 | Fabrication method of 3D feed horn shape MEMS antenna array using MRPBI system and application for microbolometer | PARK, JONG YEON; Kim, Kun Tae; Moon, S.; Park, J.-O.; Oh, M.-H.; Pak, J.J. |
2021-10 | Flat lamp fabrication using thermal grown carbon nano tubes | Lee, D.-J.; Ju, B.-K.; Lee, Y.-H.; Yoo, J.-E.; Min, B.-D.; Park, J.-H.; Kim, B.-C.; Jang, J.; Oh, M.-H. |
1997-03 | Modified low-temperature direct bonding method for vacuum microelectronics application | Ju, B.-K.; Lee, D.-J.; Choi, W.-B.; Lee, Y.-H.; Jang, J.; Lee, K.-B.; Oh, M.-H. |