| 2022-04 | A Study on Biocompatible Polymer-Based Packaging of Neural Interface for Chronic Implantation | Park, HyungDal; Choi, Won suk; Oh, Seonghwan; Kim, Yong-Jun; Seok, Seonho; KIM, JIN SEOK |
| 2024-04 | Analysis of Experimental Biaxial Surface Wrinkling Pattern Based on Direct 3D Numerical Simulation | Seok, Seonho; Park, HyungDal; KIM, JIN SEOK |
| 2023-03-22 | Analysis of metal thin-film adhesion to parylene substrate for neural electrodes using tape test | Park, HyungDal; Choi, Won suk; Oh, SungHwan; Kim, Joohee; Kwak, Sung Soo; Kim, Yong-Jun; Seok, Seonho; KIM, JIN SEOK |
| 2020-06 | Characterization and Analysis of Metal Adhesion to Parylene Polymer Substrate Using Scotch Tape Test for Peripheral Neural Probe | Seok, Seonho; Park, HyungDal; Kim, Jinseok |
| 2023-04 | Direct Numerical Simulation of Surface Wrinkling for Extraction of Thin Metal Film Material Properties | Seok, Seonho; Park, HyungDal; Coste, Philippe; Kim, Jinseok |
| 2022-11-17 | Extracting Material Properties by Metal Thin Film Thickness Using Tape Test-Based Wrinkle Structure | Park, HyungDal; Choi, Won suk; Oh, SungHwan; Kim, Yong-Jun; Seok, Seonho; KIM, JIN SEOK |
| 2023-09-26 | Improvement of Mechanical/Electrical Properties of Nano-Metal Film for Neural Electrode with Curing Rate Adjustment of Photosensitive Polyimide | Park, HyungDal; Seok, Seonho; KIM, JIN SEOK |
| 2022-08 | Mechanical Characterization and Analysis of Different-Type Polyimide Feedthroughs Based on Tensile Test and FEM Simulation for an Implantable Package | Seok, Seonho; Park, HyungDal; Kim, Yong-Jun; KIM, JIN SEOK |
| 2022-04 | Scotch-tape surface wrinkling based thin-film material properties extraction | Seok, Seonho; Park, HyungDal; Kim, Jinseok |
