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Showing results 1 to 3 of 3

Issue DateTitleAuthor(s)
-PDP tubeless packaging by using epoxy gluing process at room temperatureSeung-Il Moon; Duck-Jung Lee; OH MYUNG HWAN; LEE YUN HI; Ju Byeong Kwon; Young-Cho Kim; Gwon-Jin Moon; Jun-Dong Kim
-PDP tubeless packaging using B-stage epoxySeung-Il Moon; Duck-Jung Lee; OH MYUNG HWAN; LEE YUN HI; Ju Byeong Kwon; Young-Cho Kim; Gwon-Jin Moon; Jun-Dong Kim
-Vacuum in-line packaging technology of AC-PDP using direct-joint methodDuck-Jung Lee; Seung-Il Moon; LEE YUN HI; Ju Byeong Kwon; Jun-Dong Kim; Gwon-Jin Moon; Jin Jang
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