| 1997-03 | Anodic bonding technique under low temperature and low voltage using evaporated glass | Choi, WB; Ju, BK; Lee, YH; Haskard, MR; Sung, MY; Oh, MH |
| 2001-07 | Effects of rapid thermal annealing on the electrical properties of cobalt contact to p-GaN | Kim, JW; Kim, SI; Kim, YT; Kim, S; Sung, MY; Choi, IH |
| 1999-07 | Electrical characteristics of rf-magnetron sputtered BaTa2O6 thin film | Kim, YS; Lee, YH; Sung, MY |
| 1997-12 | Experimental analysis on the anodic bonding with an evaporated glass layer | Choi, WB; Ju, BK; Lee, YH; Jeong, JW; Haskard, MR; Lee, NY; Sung, MY; Oh, MH |
| 1999-01 | Glass-to-glass bonding for vacuum packaging of field emission display in an ultra-high-vacuum chamber using silicon thin film | Choi, WB; Ju, BK; Lee, YH; Jeong, SJ; Lee, NY; Sung, MY; Oh, MH |
| 1999-07-01 | Long-term conduction behavior of white-light emitting ZnS-based phosphor films | Lee, YH; Kim, YS; Ju, BK; Sung, MY; Oh, MH |
| 2005-04-15 | Properties of piezoelectric actuator on silicon membrane, prepared by screen printing method | Kim, SJ; Kang, CY; Choi, JW; Kim, DY; Sung, MY; Kim, HJ; Yoon, SJ |
| 1999-01 | Silicon-to-indium tin oxide coated glass bonding for packaging of field emission arrays fabricated on silicon wafer | Choi, WB; Ju, BK; Lee, YH; Oh, MH; Lee, NY; Sung, MY |
| 2001-12 | Structural investigation of GaN powders thermally annealed at various temperatures | Hong, JK; Sun, KT; Kim, S; Sung, MY; Park, CS; Koh, EK; Park, IW; Park, YJ; Kim, EK |
| 2002-01 | The analysis of oxygen plasma pretreatment for improving anodic bonding | Choi, SW; Choi, WB; Lee, YH; Ju, BK; Sung, MY; Kim, BH |
| 1999-05-10 | The effect of Al-Ta2O5 topographic interface roughness on the leakage current of Ta2O5 thin films | Kim, YS; Lee, YH; Lim, KM; Sung, MY |
| 1999-09 | The influence of surface roughness on the electric conduction process in amorphous Ta2O5 thin films | Kim, YS; Sung, MY; Lee, YH; Juh, BK; Oh, MH |
