Showing results 1 to 4 of 4
Issue Date | Title | Author(s) |
---|---|---|
1994-02-01 | FABRICATION OF SILICON MEMBRANE USING FUSION BONDING AND 2-STEP ELECTROCHEMICAL ETCH-STOPPING | JU, BK; OH, MH; TCHAH, KH |
1993-03-01 | INTERFACIAL OXIDE-GROWTH AND FILLING-UP BEHAVIOR OF THE MICRO-GAP IN SILICON FUSION BONDING PROCESSES | JU, BK; OH, MH; TCHAH, KH |
1992-11 | MICROSCOPY STUDIES FOR THE DEEP-ANISOTROPIC ETCHING OF (100) SI WAFERS | JU, BK; HA, BJ; KIM, CJ; OH, MH; TCHAH, KH |
1995-02 | ON THE ANISOTROPICALLY ETCHED BONDING INTERFACE OF DIRECTLY BONDED (100) SILICON-WAFER PAIRS | JU, BK; LEE, YH; TCHAH, KH; OH, MH |