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Issue Date | Title | Author(s) |
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2025-06 | Evaluating the Adhesive Properties of Electroless Cu on Glass-Reinforced Epoxy-Based Build-Up Dielectric Films via Nanoindentation | Kang, Yeojin; Park, Wonjung; Yoo, Dayoung; Won, Kyung-Ah; Lee, Seung-Gun; Kim, Jong-Man; Kim, Yangdo; Lee, Dongyun |