Showing results 1 to 1 of 1
Issue Date | Title | Author(s) |
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- | Tubeless packaging of field emission display using glass to glass electrostatic bonding technology | 정지원; Ju Byeong Kwon; 이덕중; LEE YUN HI; N. Y. Lee; Y. W. Ko; Y. G. Moon; CHOI DOO JIN; OH MYUNG HWAN |