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Showing results 56660 to 56679 of 74157

Issue DateTitleAuthor(s)
2006-09V 천이금속 질화물과 bcc Fe간 계면 에너지의 제일원리 연구정우상; 정순효; 변지영
2005-10V 천이금속 탄화물과 bcc Fe 간 계면에너지의 제일원리 연구정우상; 정순효; 변지영
2003-11V 홈 바닥에 형성된 일차원 InAs 양자점손창식; 최인훈; 박용주
1997-08V-grooved GaAs/AlGaAs quantum wire laser array confined by junction-isolation stripesKim, TG; Kim, EK; Min, SK; Park, JH
2015-02-08V220 Mutants of Ciona Voltage-Sensing Domain Based Genetically Encoded Fluorescent Voltage SensorsRajakumar, Dhanarajan; Piao, Hong-hua; Kang, Bok Eum; Jung, Arong; Kim, Eun Ha; Baker, Bradley J.
-V2O5 cathode for high-performance all-solid-state thin film batteryKim, Joosun; Moon, Jooho; Shin, Hyunjung; Nam, Kyung-Deog
2001-06V2O5 도핑한 페라이트 페이스트 후막 특성제해준; 김병국; 박재환; 박재관
2003-06V2O5 도핑한 페라이트 페이스트로 제조된 칩인덕터의 자기적 특성제해준
2016-12-01V2O5 제로겔/카본블랙 나노복합체 및 이의 제조방법 및 이를 첨가한 리튬-황 이차전지 양극 및 리튬-황 이차전지오시형; 조원일; Do Van Dung; 박경암; 송민섭; 김민섭
2006-05V2O5/TiO2촉매의 선택적 환원촉매반응에서 격자산소의 역할하헌필; 최희락
2003-08V2O5도핑된 NiCuZn 페라이트로 제조된 칩인덕터에서의 Ag/Cu 석출제해준; 김병국
-Vacuum hot pressing of Fe-Si-B-Nb based amorphous powder cores and their high frequency magnetic propertiesKang, Eun Young; Kim, Yoon Bae; Kim, Kwang Youn; Chung, Young Hoon; Baik Hong Koo
2006-04-15Vacuum hot pressing of Fe-Si-B-Nb-based amorphous powder cores and their high-frequency magnetic propertiesKang, E. Y.; Kim, Yoon B.; Kim, K. Y.; Chung, Y. H.; Baik, H. K.
2004-03-15Vacuum hot pressing of gas-atomized Ni-Zr-Ti-Si-Sn amorphous powderKim, YB; Park, HM; Jeung, WY; Bae, JS
-Vacuum in-line packaging and characterization of the surface-micromachined vacuum magnetic field sensorsHeung-Woo Park; Yun-Kwon Park; Duck-Jung Lee; Chul-Ju Kim; Jung-Ho Park; OH MYUNG HWAN; Ju Byeong Kwon
-Vacuum in-line packaging technology of AC-PDP using direct-joint methodDuck-Jung Lee; Seung-Il Moon; LEE YUN HI; Ju Byeong Kwon; Jun-Dong Kim; Gwon-Jin Moon; Jin Jang
-Vacuum in-line PDP sealing in low temperature by organic materials이덕중; 문권진; 김준동; 송치호; 장진; OH MYUNG HWAN; Ju Byeong Kwon
-Vacuum packaging and operating properties of micro-tunneling sensorsJu Byeong Kwon; 박흥우; 이덕중; SON YONG BAE; PARK JEONG HO; OH MYUNG HWAN
-Vacuum packaging of field emitter array using electrostatically-bonded glass-Si-glass/glass-glass structureJu Byeong Kwon; 이덕중; 정지원; Kim Hun; 이상조; LEE NAM YANG; 장진; OH MYUNG HWAN
1999Vacuum packaging using anodic bonding and emission characteristics of FEDLee, DJ; Ju, BK; Jeong, JW; Kim, H; Jung, SJ; Jang, J; Oh, MH

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