Full metadata record
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Soo-Kil Kim | - |
| dc.contributor.author | Jae Jeong Kim | - |
| dc.date.accessioned | 2024-01-13T04:32:13Z | - |
| dc.date.available | 2024-01-13T04:32:13Z | - |
| dc.date.created | 2021-09-29 | - |
| dc.identifier.uri | https://pubs.kist.re.kr/handle/201004/102577 | - |
| dc.language | English | - |
| dc.subject | Copper | - |
| dc.subject | Electrodeposition | - |
| dc.subject | Interconnection | - |
| dc.title | Copper Interconnection for Microelectronics | - |
| dc.type | Conference | - |
| dc.description.journalClass | 1 | - |
| dc.identifier.bibliographicCitation | International Conference on Microelectronics and Plasma Technology, pp.52 | - |
| dc.citation.title | International Conference on Microelectronics and Plasma Technology | - |
| dc.citation.startPage | 52 | - |
| dc.citation.endPage | 52 | - |
| dc.citation.conferencePlace | KO | - |
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