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dc.contributor.authorChoi, Hyoung Wook-
dc.contributor.author심광보-
dc.contributor.authorPark Dong Hee-
dc.contributor.author조정-
dc.contributor.authorCHOI, WON-KOOK-
dc.date.accessioned2024-01-13T05:30:20Z-
dc.date.available2024-01-13T05:30:20Z-
dc.date.created2021-09-29-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/102974-
dc.languageEnglish-
dc.subjectFCCL-
dc.subjectCOF-
dc.subject고밀도-
dc.subjectPI-
dc.titleFabrication of 2-layer flexible copper clad laminate (FCCL) with high peel strength for chip on flex (COF)-
dc.title.alternativeCOF용 고밀도 2층 FCCL제작-
dc.typeConference-
dc.description.journalClass2-
dc.identifier.bibliographicCitation2007표면공학회 춘계 학술대회논문집, pp.7 - 8-
dc.citation.title2007표면공학회 춘계 학술대회논문집-
dc.citation.startPage7-
dc.citation.endPage8-
dc.citation.conferencePlaceKO-
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