DSpace at KIST: Atomic layer deposition of W-C-N diffusion barrier and its thermal stability for Cu interconnects

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DC Field	Value	Language
dc.contributor.author	Kim, Yong Tae	-
dc.date.accessioned	2024-01-13T05:33:47Z	-
dc.date.available	2024-01-13T05:33:47Z	-
dc.date.created	2021-09-29	-
dc.identifier.uri	https://pubs.kist.re.kr/handle/201004/103224	-
dc.language	English	-
dc.title	Atomic layer deposition of W-C-N diffusion barrier and its thermal stability for Cu interconnects	-
dc.type	Conference	-
dc.description.journalClass	1	-
dc.identifier.bibliographicCitation	European Materials Research Society (E-MRS 2007 FALL MEETING), pp.98	-
dc.citation.title	European Materials Research Society (E-MRS 2007 FALL MEETING)	-
dc.citation.startPage	98	-
dc.citation.endPage	98	-
dc.citation.conferencePlace	PL	-

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