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dc.contributor.authorSoo-Kil Kim-
dc.contributor.authorJohn E. Bonevich-
dc.contributor.authorDaniel Josell-
dc.contributor.authorThomas P. Moffat-
dc.date.accessioned2024-01-13T06:00:55Z-
dc.date.available2024-01-13T06:00:55Z-
dc.date.created2021-09-29-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/103285-
dc.languageEnglish-
dc.subjectNi-
dc.subjectElectrodeposition-
dc.subjecttrench-
dc.subjectleveling-
dc.titleNi Electrodeposition in Sub-micrometer Trenches-
dc.typeConference-
dc.description.journalClass1-
dc.identifier.bibliographicCitationInternational Soiciety of Electrochemistry-
dc.citation.titleInternational Soiciety of Electrochemistry-
dc.citation.conferencePlaceCN-
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KIST Conference Paper > Others
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