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dc.contributor.authorKim, Yong Tae-
dc.contributor.authorHyun Sang Sim-
dc.contributor.authorPark Ji Ho-
dc.date.accessioned2024-01-13T10:03:51Z-
dc.date.available2024-01-13T10:03:51Z-
dc.date.created2021-09-29-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/105604-
dc.languageEnglish-
dc.titleCharacteristics of Pulse Plasma Atomic Layer Deposited W-C-N Diffusion Barrier for Cu Interconnect-
dc.typeConference-
dc.description.journalClass1-
dc.identifier.bibliographicCitationThe 206th Meeting of the Electrochemical Society in Honolulu-
dc.citation.titleThe 206th Meeting of the Electrochemical Society in Honolulu-
dc.citation.conferencePlaceUS-
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