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dc.contributor.author황은수-
dc.contributor.author김용준-
dc.contributor.authorJu Byeong Kwon-
dc.date.accessioned2024-01-13T11:32:22Z-
dc.date.available2024-01-13T11:32:22Z-
dc.date.created2021-09-29-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/106310-
dc.languageEnglish-
dc.subjectflexible packaging-
dc.subjectsensor array-
dc.subjectrelease-etching-
dc.subjectpiezoresistivity-
dc.subjectstrain gauge-
dc.titleFlexible polysilicon sensor array modules using "Etch-Release" Packaging Scheme-
dc.title.alternativeEtch-release 패키징 방법을 이용한 flexible 폴리실리콘 센서 어레이 모듈-
dc.typeConference-
dc.description.journalClass2-
dc.identifier.bibliographicCitation한국 MEMS 학술대회, pp.40 - 45-
dc.citation.title한국 MEMS 학술대회-
dc.citation.startPage40-
dc.citation.endPage45-
dc.citation.conferencePlaceKO-
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