DSpace at KIST: Flexible module packaging using MEMS technology

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DC Field	Value	Language
dc.contributor.author	황은수	-
dc.contributor.author	최석문	-
dc.contributor.author	Ju Byeong Kwon	-
dc.contributor.author	김용준	-
dc.date.accessioned	2024-01-13T12:33:20Z	-
dc.date.available	2024-01-13T12:33:20Z	-
dc.date.created	2021-09-29	-
dc.identifier.uri	https://pubs.kist.re.kr/handle/201004/106902	-
dc.language	English	-
dc.title	Flexible module packaging using MEMS technology	-
dc.title.alternative	MEMS 기술을 이용한 flexible module packaging	-
dc.type	Conference	-
dc.description.journalClass	2	-
dc.identifier.bibliographicCitation	마이크로 전자 및 패키징학회 춘계 기술 심포지움, pp.74 - 78	-
dc.citation.title	마이크로 전자 및 패키징학회 춘계 기술 심포지움	-
dc.citation.startPage	74	-
dc.citation.endPage	78	-
dc.citation.conferencePlace	KO	-

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