Full metadata record
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | PARK YOUNG JOON | - |
| dc.contributor.author | 최인석 | - |
| dc.contributor.author | 주영창 | - |
| dc.date.accessioned | 2024-01-13T15:02:26Z | - |
| dc.date.available | 2024-01-13T15:02:26Z | - |
| dc.date.created | 2021-09-29 | - |
| dc.identifier.uri | https://pubs.kist.re.kr/handle/201004/108156 | - |
| dc.language | English | - |
| dc.subject | electromigration | - |
| dc.subject | stress | - |
| dc.subject | simulation | - |
| dc.title | Electromigration-induced stress interaction between via and polygranular cluster | - |
| dc.type | Conference | - |
| dc.description.journalClass | 1 | - |
| dc.identifier.bibliographicCitation | Mat. Res. Soc. Symp. Proc., v.612, pp.D8.11.1 - D8.11.6 | - |
| dc.citation.title | Mat. Res. Soc. Symp. Proc. | - |
| dc.citation.volume | 612 | - |
| dc.citation.startPage | D8.11.1 | - |
| dc.citation.endPage | D8.11.6 | - |
| dc.citation.conferencePlace | US | - |
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