Full metadata record
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 김동준 | - |
| dc.contributor.author | 심현상 | - |
| dc.contributor.author | Kim Yong Tae | - |
| dc.contributor.author | KIM CHUN KEUN | - |
| dc.contributor.author | 박종완 | - |
| dc.date.accessioned | 2024-01-13T15:31:21Z | - |
| dc.date.available | 2024-01-13T15:31:21Z | - |
| dc.date.created | 2021-09-29 | - |
| dc.identifier.uri | https://pubs.kist.re.kr/handle/201004/108360 | - |
| dc.language | English | - |
| dc.subject | W-N diffusion barrier | - |
| dc.title | Enhancement of the electical and physical properties of Cu/W-N/HSQ interconnection scheme by NH₃ plasma treatment | - |
| dc.type | Conference | - |
| dc.description.journalClass | 1 | - |
| dc.identifier.bibliographicCitation | The International Conference on Electrical Engineering 2000, pp.766 - 769 | - |
| dc.citation.title | The International Conference on Electrical Engineering 2000 | - |
| dc.citation.startPage | 766 | - |
| dc.citation.endPage | 769 | - |
| dc.citation.conferencePlace | JA | - |
- Appears in Collections:
- KIST Conference Paper > Others
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