Full metadata record
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Ju Byeong Kwon | - |
| dc.date.accessioned | 2024-01-13T16:00:59Z | - |
| dc.date.available | 2024-01-13T16:00:59Z | - |
| dc.date.created | 2021-09-29 | - |
| dc.identifier.uri | https://pubs.kist.re.kr/handle/201004/108618 | - |
| dc.subject | MEMS | - |
| dc.title.alternative | 기판 접합 공정 및 마이크로 패키징 응용 | - |
| dc.type | Conference | - |
| dc.description.journalClass | 2 | - |
| dc.identifier.bibliographicCitation | 한국센서학회 서울 / 경인지부 창립총회, pp.? | - |
| dc.citation.title | 한국센서학회 서울 / 경인지부 창립총회 | - |
| dc.citation.startPage | ? | - |
| dc.citation.endPage | ? | - |
| dc.citation.conferencePlace | KO | - |
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