Full metadata record
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Ju Byeong Kwon | - |
| dc.contributor.author | 이덕중 | - |
| dc.contributor.author | 장진 | - |
| dc.contributor.author | OH MYUNG HWAN | - |
| dc.date.accessioned | 2024-01-13T16:31:08Z | - |
| dc.date.available | 2024-01-13T16:31:08Z | - |
| dc.date.created | 2021-09-29 | - |
| dc.identifier.uri | https://pubs.kist.re.kr/handle/201004/108895 | - |
| dc.language | English | - |
| dc.subject | wafer bonding | - |
| dc.title | Study on glass-to-silicon anodic bonding using hydrophilic process | - |
| dc.type | Conference | - |
| dc.description.journalClass | 2 | - |
| dc.identifier.bibliographicCitation | 제 7 회 반도체 학술대회, pp.645 - 646 | - |
| dc.citation.title | 제 7 회 반도체 학술대회 | - |
| dc.citation.startPage | 645 | - |
| dc.citation.endPage | 646 | - |
| dc.citation.conferencePlace | KO | - |
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