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dc.contributor.authorJu Byeong Kwon-
dc.contributor.author이덕중-
dc.contributor.author장진-
dc.contributor.authorOH MYUNG HWAN-
dc.date.accessioned2024-01-13T16:31:08Z-
dc.date.available2024-01-13T16:31:08Z-
dc.date.created2021-09-29-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/108895-
dc.languageEnglish-
dc.subjectwafer bonding-
dc.titleStudy on glass-to-silicon anodic bonding using hydrophilic process-
dc.typeConference-
dc.description.journalClass2-
dc.identifier.bibliographicCitation제 7 회 반도체 학술대회, pp.645 - 646-
dc.citation.title제 7 회 반도체 학술대회-
dc.citation.startPage645-
dc.citation.endPage646-
dc.citation.conferencePlaceKO-
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