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dc.contributor.authorLEE SEUNG ICK-
dc.contributor.authorMyung Ki You-
dc.contributor.author문인형-
dc.date.accessioned2024-01-13T16:31:57Z-
dc.date.available2024-01-13T16:31:57Z-
dc.date.created2021-09-29-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/108948-
dc.languageEnglish-
dc.titleEffect of microstructure on the coefficient of thermal expansion and young's modulus in tungsten-copper composites-
dc.typeConference-
dc.description.journalClass1-
dc.identifier.bibliographicCitation2000 Advances in Powder Metallurgy & Particulate Materials, pp.1 - 7-
dc.citation.title2000 Advances in Powder Metallurgy & Particulate Materials-
dc.citation.startPage1-
dc.citation.endPage7-
dc.citation.conferencePlaceUS-
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