DSpace at KISTKIST Conference PaperOthers

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dc.contributor.authorJu Byeong Kwon-
dc.contributor.author김일명-
dc.contributor.author이승준-
dc.contributor.author강경두-
dc.contributor.author정수태-
dc.contributor.author정귀상-
dc.date.accessioned2024-01-13T17:32:52Z-
dc.date.available2024-01-13T17:32:52Z-
dc.date.created2021-09-29-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/109537-
dc.subjectwafer bonding-
dc.title.alternative직접접합과 전기화학적 식각정지법에 의한 SOI 기판 제작-
dc.typeConference-
dc.description.journalClass2-
dc.identifier.bibliographicCitation센서학회 종합학술대회, pp.355 - 358-
dc.citation.title센서학회 종합학술대회-
dc.citation.startPage355-
dc.citation.endPage358-
dc.citation.conferencePlaceKO-
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