Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Ju Byeong Kwon | - |
dc.contributor.author | 김일명 | - |
dc.contributor.author | 이승준 | - |
dc.contributor.author | 강경두 | - |
dc.contributor.author | 정수태 | - |
dc.contributor.author | 정귀상 | - |
dc.date.accessioned | 2024-01-13T17:32:52Z | - |
dc.date.available | 2024-01-13T17:32:52Z | - |
dc.date.created | 2021-09-29 | - |
dc.identifier.uri | https://pubs.kist.re.kr/handle/201004/109537 | - |
dc.subject | wafer bonding | - |
dc.title.alternative | 직접접합과 전기화학적 식각정지법에 의한 SOI 기판 제작 | - |
dc.type | Conference | - |
dc.description.journalClass | 2 | - |
dc.identifier.bibliographicCitation | 센서학회 종합학술대회, pp.355 - 358 | - |
dc.citation.title | 센서학회 종합학술대회 | - |
dc.citation.startPage | 355 | - |
dc.citation.endPage | 358 | - |
dc.citation.conferencePlace | KO | - |
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