DSpace at KISTKIST Conference PaperOthers

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dc.contributor.authorJu Byeong Kwon-
dc.contributor.author이덕중-
dc.contributor.author정지원-
dc.contributor.authorOH MYUNG HWAN-
dc.contributor.author정성재-
dc.contributor.authorLEE NAM YANG-
dc.contributor.author고영욱-
dc.contributor.authorLEE CHOONG HOON-
dc.contributor.author한정인-
dc.contributor.author조경익-
dc.contributor.authorCHOI DOO JIN-
dc.date.accessioned2024-01-13T18:30:41Z-
dc.date.available2024-01-13T18:30:41Z-
dc.date.created2021-09-29-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/109935-
dc.languageEnglish-
dc.subjectMEMS-
dc.titleGlass-to glass wafer anodic bonding and its application to FEA/FED micro-packaging-
dc.typeConference-
dc.description.journalClass2-
dc.identifier.bibliographicCitationIDRC '98, pp.145 - 148-
dc.citation.titleIDRC '98-
dc.citation.startPage145-
dc.citation.endPage148-
dc.citation.conferencePlaceKO-
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