DSpace at KISTKIST Conference PaperOthers

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dc.contributor.authorJu Byeong Kwon-
dc.contributor.author이덕중-
dc.contributor.author정지원-
dc.contributor.author안준호-
dc.contributor.authorKim Hun-
dc.contributor.authorOH MYUNG HWAN-
dc.date.accessioned2024-01-13T19:03:01Z-
dc.date.available2024-01-13T19:03:01Z-
dc.date.created2021-09-29-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/110345-
dc.languageEnglish-
dc.subjectMEMS-
dc.titleFED Tubeless packaging by vacuum-electrostatic bonding-
dc.title.alternative진공-정전 열 접합을 이용한 FED의 Tubeless Packaging-
dc.typeConference-
dc.description.journalClass2-
dc.identifier.bibliographicCitation제 9 회 센서기술학술대회 = The 9th Conference on Sensor Technology '98, pp.455 - 460-
dc.citation.title제 9 회 센서기술학술대회 = The 9th Conference on Sensor Technology '98-
dc.citation.startPage455-
dc.citation.endPage460-
dc.citation.conferencePlaceKO-
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