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dc.contributor.authorJu Byeong Kwon-
dc.contributor.author이덕중-
dc.contributor.authorOH MYUNG HWAN-
dc.date.accessioned2024-01-13T19:03:02Z-
dc.date.available2024-01-13T19:03:02Z-
dc.date.created2021-09-29-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/110347-
dc.languageEnglish-
dc.subjectMEMS-
dc.subjectFED-
dc.subjectFEA-
dc.titlePackaging of vacuum microelectronic device using electrostatic bonding-
dc.title.alternative정전 열 접합에 의한 진공전자소자의 패키징-
dc.typeConference-
dc.description.journalClass2-
dc.identifier.bibliographicCitation대한전기학회 추계학술대회, pp.?-
dc.citation.title대한전기학회 추계학술대회-
dc.citation.startPage?-
dc.citation.endPage?-
dc.citation.conferencePlaceKO-
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