DSpace at KISTKIST Conference PaperOthers

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dc.contributor.authorPark In Seon-
dc.contributor.author위영진-
dc.contributor.author이현덕-
dc.contributor.author박창수-
dc.contributor.author최길현-
dc.contributor.authorJung Woo Sang-
dc.contributor.author이문용-
dc.contributor.author이문용-
dc.date.accessioned2024-01-13T22:01:09Z-
dc.date.available2024-01-13T22:01:09Z-
dc.date.created2021-09-29-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/111831-
dc.languageEnglish-
dc.subjectAl-reflow-
dc.titleEnhanced via reliability by Al-reflow for multi-level metallization-
dc.typeConference-
dc.description.journalClass2-
dc.identifier.bibliographicCitationInternational conference on VLSI and CAD (ICVC, 95), v.95, no.195, pp.29 - 32-
dc.citation.titleInternational conference on VLSI and CAD (ICVC, 95)-
dc.citation.volume95-
dc.citation.number195-
dc.citation.startPage29-
dc.citation.endPage32-
dc.citation.conferencePlaceKO-
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