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dc.contributor.authorJu Byeong Kwon-
dc.contributor.authorOH MYUNG HWAN-
dc.contributor.authorJ. D. Mun-
dc.contributor.authorJ. Y. Oh-
dc.contributor.authorY. R. Cho-
dc.contributor.authorH. S. Jeong-
dc.date.accessioned2024-01-13T22:01:57Z-
dc.date.available2024-01-13T22:01:57Z-
dc.date.created2021-09-29-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/111877-
dc.languageEnglish-
dc.subjectanodic bonding-
dc.subjectSi-glass bonding-
dc.subjectparticle effect-
dc.titleLarge area electrostatic bonding for macropackaging of a field emission display-
dc.typeConference-
dc.description.journalClass1-
dc.identifier.bibliographicCitation15th IDRC/Asia display '95, ACT CITY Hamamatsu, Japan., pp.621 - 624-
dc.citation.title15th IDRC/Asia display '95, ACT CITY Hamamatsu, Japan.-
dc.citation.startPage621-
dc.citation.endPage624-
dc.citation.conferencePlaceJA-
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