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dc.contributor.authorKim Yong Tae-
dc.contributor.author권철순-
dc.contributor.author김동준-
dc.contributor.author이창우-
dc.contributor.author최인훈-
dc.date.accessioned2024-01-13T22:32:52Z-
dc.date.available2024-01-13T22:32:52Z-
dc.date.created2021-09-29-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/112200-
dc.languageEnglish-
dc.titleComparison of amorphous and polycrystalline tungsten nitride diffusion barrier for MOCVD-Cu metallization.-
dc.typeConference-
dc.description.journalClass1-
dc.identifier.bibliographicCitationFall meeting of MRS, pp.?-
dc.citation.titleFall meeting of MRS-
dc.citation.startPage?-
dc.citation.endPage?-
dc.citation.conferencePlaceUS-
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KIST Conference Paper > Others
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