Full metadata record
DC Field | Value | Language |
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dc.contributor.author | Song, Kahye | - |
dc.contributor.author | Cha, Youngsu | - |
dc.contributor.author | Park, Jung-Min | - |
dc.date.accessioned | 2024-01-19T09:38:21Z | - |
dc.date.available | 2024-01-19T09:38:21Z | - |
dc.date.created | 2022-02-28 | - |
dc.date.issued | 2019-11 | - |
dc.identifier.issn | 1876-1100 | - |
dc.identifier.uri | https://pubs.kist.re.kr/handle/201004/113862 | - |
dc.description.abstract | In this study, we propose a seesaw type actuator, and we investigate its actuation to determine the most efficient structure. When a high voltage input is applied between the L-shaped actuator and metal plate at the bottom substrate, another panel rises due to reaction of the electrostatic attraction. And it leads to tactile stimulation. In addition, we add a round cap to the edge of the panel of the actuator for more effective stimulation delivery. Various types of actuators experiments showed that the actuator with the largest radius of motion was an actuator with a narrow angle and a long length, and the axis of rotation coincided with the axis of gravity. This is because narrower angles between actuators increase the movable radius of motion and longer actuators can induce electrostatic attraction of larger forces and lose balance if the center of gravity axis does not match. Both gravity and electrostatic attraction are utilized for the operation of the actuator, and this actuator generates strong tactile stimulation without the risk of electric shock to users by separating the user contact part from the electrostatic force region. We expect that this new actuation mechanism is adapted to various haptic devices in the future to help the human-computer interaction. | - |
dc.language | English | - |
dc.publisher | SPRINGER-VERLAG SINGAPORE PTE LTD | - |
dc.title | Seesaw Type Actuator for Haptic Application | - |
dc.type | Conference | - |
dc.identifier.doi | 10.1007/978-981-13-3194-7_37 | - |
dc.description.journalClass | 1 | - |
dc.identifier.bibliographicCitation | 3rd International Conference on AsiaHaptics, pp.169 - 172 | - |
dc.citation.title | 3rd International Conference on AsiaHaptics | - |
dc.citation.startPage | 169 | - |
dc.citation.endPage | 172 | - |
dc.citation.conferencePlace | SI | - |
dc.citation.conferencePlace | Incheon, SOUTH KOREA | - |
dc.citation.conferenceDate | 2018-11-14 | - |
dc.relation.isPartOf | HAPTIC INTERACTION: PERCEPTION, DEVICES AND ALGORITHMS | - |
dc.identifier.wosid | 000493282100037 | - |
dc.identifier.scopusid | 2-s2.0-85065981488 | - |
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