Effective Schottky barrier height and interface trap density reduction engineering using 2-dimensional reduced graphene oxide interlayer for metal-interlayer-semiconductor contact structure

Authors
Song, SungjooKim, Seung-HwanKim, Seung-GeunHan, Kyu-HyunKim, Hyung-junYu, Hyun-Yong
Issue Date
2023-03
Publisher
Elsevier BV
Citation
Journal of Alloys and Compounds, v.937
Abstract
The contact resistance at the metal-semiconductor (MS) interface has become the foremost challenge to ensuring high performance in nanoelectronics as devices are scaled down. A metal-interlayer-semi-conductor (MIS) contact structure is a promising technique for Fermi-level unpinning to overcome the issue of fundamental contact resistance. Herein, an MIS contact structure with a 2-dimensional reduced graphene oxide (rGO) interlayer is proposed as an effective source/drain contact structure. The demonstration of a metal-rGO-semiconductor MIS (rGO MIS) contact structure with different interlayer thicknesses indicated that the rGO interlayer with a thickness of a few nanometers significantly enhanced the reverse current density (JR) by similar to 2.0 x 103 times compared to that of the MS contact. In addition, the effective Schottky barrier height was reduced from 0.576 to 0.205 eV. This drastic improvement is attributed to the unique properties of rGO, such as its wide band gap, electrical conductivity, and Van der Waals interface leading to a metal-induced gap state reduction, tunneling resistance lowering, and passivation effect when it is adopted as an interlayer of the MIS contact. This result demonstrates the promising potential of using rGO as an MIS interlayer, which will pave the way toward high-performance emerging nanoelectronic devices.(c) 2022 Published by Elsevier B.V.
Keywords
METAL/SEMICONDUCTOR INTERFACE; SURFACE PASSIVATION; GE; RESISTIVITY; LAYER; RESISTANCE; SILICON; PLASMA; Source; drain contact; Contact resistance; Metal; interlayer; semiconductor structure; Fermi-level unpinning; Reduced graphene oxide
ISSN
0925-8388
URI
https://pubs.kist.re.kr/handle/201004/113977
DOI
10.1016/j.jallcom.2022.168327
Appears in Collections:
KIST Article > 2023
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