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dc.contributor.authorSong, Ryungeun-
dc.contributor.authorLee, Minki-
dc.contributor.authorMoon, Hyeokgyun-
dc.contributor.authorLee, Saebom-
dc.contributor.authorShin, Seonghun-
dc.contributor.authorKim, Dohyung-
dc.contributor.authorKim, Yoonhyun-
dc.contributor.authorOh, Bukuk-
dc.contributor.authorLee, Jinkee-
dc.date.accessioned2024-01-19T13:03:27Z-
dc.date.available2024-01-19T13:03:27Z-
dc.date.created2022-04-03-
dc.date.issued2021-12-
dc.identifier.issn2058-8585-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/115955-
dc.description.abstractWe study particle dynamics in drying colloidal solutions using the numerical simulation with discrete particle method. Simulations of two different systems were conducted; the drying dynamics of monodispersed and binary mixture of colloidal solution, and compared with those from the previous studies. In the monodispersed colloidal solution, the time evolution of particle concentration profile for varying Peclet number was simulated with the same initial particle concentration. In the binary colloidal solution, when the particle size ratio alpha is 3, three different stratification modes were observed varying Peclet number and initial particle concentration. By comparison, our method was in a good agreement with the existing methods. Additionally, because of the mesh-based Eulerian approach in our model, other various multi-physical phenomena, such as effect of thermal Marangoni or chemical reaction, can be included in an easy way. From the results, we expect that this work can provide a physical insight for predicting the quality of colloidal drying in a complicated situation.-
dc.languageEnglish-
dc.publisherIOP PUBLISHING LTD-
dc.subjectNUMERICAL-SIMULATION-
dc.subjectFILMS-
dc.subjectSTRATIFICATION-
dc.subjectMICROSTRUCTURE-
dc.subjectDISPERSIONS-
dc.subjectTRANSISTORS-
dc.subjectSURFACES-
dc.subjectSTRESSES-
dc.subjectCRACKING-
dc.subjectGROWTH-
dc.titleParticle dynamics in drying colloidal solution using discrete particle method-
dc.typeArticle-
dc.identifier.doi10.1088/2058-8585/ac428e-
dc.description.journalClass1-
dc.identifier.bibliographicCitationFlexible and Printed Electronics, v.6, no.4-
dc.citation.titleFlexible and Printed Electronics-
dc.citation.volume6-
dc.citation.number4-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.identifier.wosid000735615800001-
dc.identifier.scopusid2-s2.0-85122616909-
dc.relation.journalWebOfScienceCategoryMaterials Science, Multidisciplinary-
dc.relation.journalResearchAreaMaterials Science-
dc.type.docTypeArticle-
dc.subject.keywordPlusNUMERICAL-SIMULATION-
dc.subject.keywordPlusFILMS-
dc.subject.keywordPlusSTRATIFICATION-
dc.subject.keywordPlusMICROSTRUCTURE-
dc.subject.keywordPlusDISPERSIONS-
dc.subject.keywordPlusTRANSISTORS-
dc.subject.keywordPlusSURFACES-
dc.subject.keywordPlusSTRESSES-
dc.subject.keywordPlusCRACKING-
dc.subject.keywordPlusGROWTH-
dc.subject.keywordAuthordrying process-
dc.subject.keywordAuthorcolloidal packing-
dc.subject.keywordAuthordiscrete particle method-
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KIST Article > 2021
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